About us
Product Catalog
Product 1
Thermal Silicone Sheet  Series
Thermal Alumina Ceramic
Insulation Silicone Series
Graphite Film  Serial
Thermal Encapsulant Series
Electromagnetic Shielding Material
Thermal Double-Sided Tape
Thermal Phase Change Interface Materail
 Heater Pad/Film Series
News
Contact Us
Document
FAQ

Product Catalog 

 

Heat Dissipation Pad Thermal Gap Filler For LED / CPU / PCB Module

  • Heat Dissipation Pad Thermal Gap Filler For LED / CPU / PCB Module
  • Heat Dissipation Pad Thermal Gap Filler For LED / CPU / PCB Module
  • Heat Dissipation Pad Thermal Gap Filler For LED / CPU / PCB Module
  • Heat Dissipation Pad Thermal Gap Filler For LED / CPU / PCB Module
  • Heat Dissipation Pad Thermal Gap Filler For LED / CPU / PCB Module
Model No.︰PM 300
Brand Name︰JRFT
Country of Origin︰China
Unit Price︰US $ 0.003 / pc
Minimum Order︰10 pc
Share on:

 Total 32 Related Items 
Prev89101112Next

Product Description

Applications: 
1.Car engine module, notebook computer 
2.Flat panel TV, mobile equipment, high-speed hard disk drive 
3.Between semiconductor and radiating fin 
4.Desktop, portable computer and server 
5.LED lighting device, the power supply of UPS 
6.LED and PDP flat panel display 


Performance: 
◆High thermal conductivity:3.2W/m-k 
◆Stable Performance, low thermal resistance, effectively improve the heat transfer speed 
◆Low hardness, its viscosity high, easy to use 


Specification: 
◆Standard size:310mm*310mm, 200mm*400mm according to customer needs cut the shape 
◆Basic thickness:0.25mm*5.0mm, special size and thickness can be customized 
Its slightly viscous, if need to strengthen the adhesive can be according to customer’s requirement 
◆Product color is mass production color, need special color can be adjusted according to the actual situation 

PM300 thermal pad combine high thermal conductivity with compliance perfect, can fill the gaps, improve heating parts and the radiating part of the heat transfer capacity. These soft interface material can make the minimum pressure and the surface to combine , resulting in little or no stress on mating parts. Taking advantage of silicone soft  and elastic characteristics, placed between the power heating device and heat dissipating structure, the power module effectively transfer the heat to the radiating component. 

Price Terms︰FOB/CIF
Payment Terms︰TT / Western Union / Paypal / MoneyGram
Lead Time︰After Payment 1-3 working days
Color︰Grey / Blue / Black
Size︰200mm*400mm 310mm*310mm (customized)
Product Image






Related Products
High Quality Thermally Conductive Non Silicone  Pad For CPU
High Quality Thermally Conductive Non Silicone Pad For CPU
US $ 0.017
Thermal Conductive Non Silicone Gap Filler Pad For Heatsink / LED / CPU
Thermal Conductive Non Silicone Gap Filler Pad For Heatsink / LED / CPU
US $ 0.017
Non silicon oil cooling thermal conductive gap pad
Non silicon oil cooling thermal conductive gap pad
US $ 0.017
Thermal conductivity of silica gel film
Thermal conductivity of silica gel film
US $ 0.02

About us  |  Product Catalog  |  News  |  Contact Us  |  Document  |  FAQ  |  Sitemap  |  Mobile Version
  English     简体版     繁體版
Powered by DIYTrade.com
HomeContact UsSitemap